사용법
공사, 섬유 & 의복, 신발 & 가죽, 포장, 교통, 목공, PCB/Electronics
Product name
Electronic Adhesive
Usage
Power Supply,Computer,Lighting
Component
Single-component
Curing Condition
Moisture curing at room temperature
Bonding Strength(Mpa)
>=1.0
Thermal Conductivity(W/m K)
>=0.8