소재
C7025 SUS301 H-Copper Alloy
Plating specification
Tinning of contact points
Contact Resistance
≤20MΩ Max
Insulating Resistance
≥1000mΩ Min
Pressure connection diameter
0.13-0.17/0.25-0.35/0.5-0.75
Temperture Range
-40℃ to +125℃
OD
0.85-1.25/0.9-1.4/1.4-1.9
Four guidelines
Brass/nickel/gold plated surface