기타 이름
epoxy conductive adhesive
MF
epoxy conductive adhesive
EINECS 번호
epoxy conductive adhesive
Product Name
Epoxy Conductive Adhesive
Application
Crystal Oscillator
Form
Epoxy-Silver System, Single component
Appearance
Micro Thixotropic, paste
Use method
Dispensing or Postage stamp gum
Curing
120°C/60min, 150°C/30min, 170°C/10min